NEW DELHI: The government is aiming to make hightech small chips of 3-nanometre node - used in products like modern smartphones and computers - by 2032, Union minister Ashwini Vaishnaw said on Tuesday.
The minister said the government will focus on six categories of chips - compute, radio frequency (RF), networking, power, sensor, and memory - under the second phase of Design-Linked Incentive Scheme that will allow companies in the country to have major control on developing 70-75 per cent technology products.
“The level of 2032 is to reach 3-nanometer chips manufacturing and design. Design, of course, we are doing even today. But manufacturing we should reach 3 nanometer,” the minister said, after meeting with 24 chip design firms that have been selected under the Design-Linked Incentive Scheme. Vaishnaw said the government wants to focus on six major systems “so that we develop our complete semiconductor design ecosystem in a very comprehensive way”.
“Compute, RF, networking, power, sensor, and memory we will encourage academia and industry to come up with new ideas, new thoughts, new solutions in these six major
The government will focus on six categories of chips - compute, radio frequency, networking, power, sensor, and memory categories. As we go into 2029, we will have a major capability of manufacturing and designing the chips, which are required practically in 70-75 per cent of all applications in our country,” the minister said.
He said every sector will require a combination or a permutation of these six types of chips.